This project plans to purchase and implement the firm of equipment for assembly of printed circuit boards. The equipment includes: (1) Technological line for the assembly of printed circuit boards consisting of Stencil Printer, PICK and PLACE machine and Tunnel Reflow Oven (2) Computer configuration for process control, and (3) Dip Soldering Machine. At the time of submission of the project proposal all manufacturing operations in the company are carried out manually. After commissioning of the subjected equipment, almost all manufacturing operations will be automated. Solder paste transfer will be done with modern Stencil Printer, the loading of components on boards will be performed by a robotized Pick-and-Place machine, and soldering of the SMT components will be done through Reflow Oven under computer control. As a result of the purchase of new equipment entirely new technology will be introduced. The production process will be reorganized in an entirely new way and new job positions will be opened. The commissioning of the line for assembly will optimize the production process by drastically reducing manual labor, by introduction of new technological operations which will be carried out by the machinery of newly introduced equipment. The resource efficiency of the production process will be improved, as the necessary time per product unit will be shortened dozens of times. The supplies and energy per production unit will drop significantly, the effectiveness and productivity of the workforce will increase, as the man-hours required per unit of product will be reduces. Until now, "Largonet" has been working exclusively with foreign customers. Successful realization of the project will ensure the preservation and increase of exports on the one hand and on the other will allow entering the domestic market and attracting new customers.
Overview
Status | Closed (completion date) |
---|---|
Start date | 09 Feb, 2016 |
End date | 15 Dec, 2016 |
Contract date | 09 Feb, 2016 |
Programme
Beneficiary
Financial information
Total cost | 168,172.66 |
---|---|
Grant | 117,720.86 |
Self finance | 50,451.80 |
Total paid | 117,680.50 |
EU participation percent | 85.0% |
Location